ligitek electronics co.,ltd. property of ligitek only pb lead-free parts LSR13740-PF - 2008 a 14 - apr. LSR13740-PF data sheet doc. no : qw0905- rev. : date : round type led lamps
directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. package dimensions ligitek electronics co.,ltd. property of ligitek only part no. LSR13740-PF page 1/5 5.9 5.0 1.5max 8.6 7.6 2.54typ 1.0min - + ? 0.5typ 25.0min 0 25% 75% 100%50% -60 -30 75% 25% 0 50% 30 100% 60
3865 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr symbol typical electrical & optical characteristics (ta=25 ) power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 100 -40 ~ +100 -40 ~ +85 ir10 ratings sr 100 30 mw a ma ma unit ligitek electronics co.,ltd. property of ligitek only page2/5 68 viewing angle 2 1/2 (deg) min. 20 min. 1.5 forward voltage @ ma(v) max. 2.4 peak wave length pnm 660 spectral halfwidth nm 20 typ. luminous intensity @20ma(mcd) emitted red part no LSR13740-PF material gaalas lens color red diffused part no. LSR13740-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -4040 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 sr chip page3/5 part no. LSR13740-PF
note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. page 4/5 ligitek electronics co.,ltd. property of ligitek only dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 150 time(sec) 260 c3sec max temp( c) 260 100 120 50 preheat 0 0 25 2 /sec max 60 seconds max 5 /sec max part no. LSR13740-PF
page 5/5 ligitek electronics co.,ltd. property of ligitek only reference standard description mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. this test intended to see soldering well performed or not. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. test item reliability test: high temperature storage test low temperature storage test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. thermal shock test high temperature high humidity test operating life test solderability test 1.t.sol=230 5 2.dwell time=5 1sec test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles part no. LSR13740-PF
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